Real-time SPI perception
Paste-volume, area-ratio, and registration risk scored per deposit.
Autonomous solder-paste printing and pick-and-place. Converges first-pass yield before the board leaves the head — closing the loop across the printer, SPI, and mounter.
The front of the SMT line decides the board's fate: paste volume, area ratio, stencil registration, and sub-25µm placement offsets set up 70%+ of downstream defects — tuned by hand by scarce, retiring engineers.
Stencix perceives SPI and placement in real time, predicts which deposits and placements will fail, and autonomously adjusts print pressure, squeegee speed, separation, clean cadence, and per-nozzle offsets to converge yield.
Paste-volume, area-ratio, and registration risk scored per deposit.
Pressure, speed, separation, and stencil-clean cadence tuned in the loop.
Per-part offset correction and nozzle/feeder prognostics.
Recipe carry-over from similar boards for fast changeover.
Approval policies with an assurance-grade audit trail.
Printer, mounter, SPI, and MES/traceability integration.
It shares perception, twin validation, and orchestration with the rest of Circuex — so every action is grounded and every result feeds the next board.
You choose how much control Stencix takes — and it earns the next level by proving itself.
Stencix perceives and predicts with zero write-back — you validate its calls against reality.
It surfaces grounded recommendations with the evidence behind each one.
Operators approve actions one at a time under policy, building trust and data.
Stencix tunes autonomously within guardrails, escalating only exceptions.
Trained on DGX/HGX, served at the edge on Jetson and IGX, validated in Omniverse and Isaac Sim.
Once Stencix went closed-loop, the stage stopped being the bottleneck. It just holds yield — and tells us why when it doesn't.
Book a working session and watch Stencix perceive, predict, and close the loop against your line data.